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MEM2012F 数据表(PDF) 3 Page - TDK Electronics |
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MEM2012F 数据表(HTML) 3 Page - TDK Electronics |
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3 / 4 page ![]() Please be sure to request delivery specifications that provide further details on the features and specifications of the products for proper and safe use. Please note that the contents may change without any prior notice due to reasons such as upgrading. 20190207 (3/4) 3tf_commercial_signal_mem2012f_en.fm EMC Components MEM2012F type SHAPE & DIMENSIONS RECOMMENDED LAND PATTERN CIRCUIT DIAGRAM RECOMMENDED REFLOW PROFILE PACKAGING STYLE REEL DIMENSIONS TAPE DIMENSIONS PACKAGE QUANTITY TEMPERATURE RANGE, INDIVIDUAL WEIGHT The storage temperature range is for after the assembly. Dimensions in mm 2 ±0.2 GND 4 1 IN/OUT 2 GND 3 OUT/IN 0.4 ±0.15 0.4±0.15 0.4±0.15 0.2min 0.2min Dimensions in mm 3 0.4 1.4 1.6 GND Natural cooling 10s max. 60 to 120s Preheating 30 to 60s Soldering 230°C 230°C 250 to 260°C 180°C 150°C Time Peak Type A B K MEM2012F 1.55±0.20 2.30±0.20 1.10max. Package quantity 4,000 pcs/reel Operating temperature range Storage temperature range Individual weight –40 to +85 °C –40 to +85 °C 8 mg 2.0±0.5 ø13±0.2 ø21±0.8 Dimensions in mm 1.0 E ø180±2.0 14.4max. 8.4 +2.0 –0.0 4.0±0.1 4.0±0.1 2.0±0.05 A Dimensions in mm Sprocket hole 1.5 +0.1 –0 Cavity K 160min. Taping 200min. 300min. Drawing direction Dimensions in mm |
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