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LM393DGKR 数据表(PDF) 49 Page - Texas Instruments |
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LM393DGKR 数据表(HTML) 49 Page - Texas Instruments |
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49 / 55 page ![]() www.ti.com PACKAGE OUTLINE C 8X 0.32 0.18 1.6 0.1 2X 1.5 0.9 0.1 6X 0.5 8X 0.4 0.2 0.05 0.00 0.8 MAX A 2.1 1.9 B 2.1 1.9 0.32 0.18 0.4 0.2 (0.2) TYP WSON - 0.8 mm max height DSG0008A PLASTIC SMALL OUTLINE - NO LEAD 4218900/D 04/2020 PIN 1 INDEX AREA SEATING PLANE 0.08 C 1 4 5 8 PIN 1 ID 0.1 C A B 0.05 C THERMAL PAD EXPOSED 9 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance. SCALE 5.500 ALTERNATIVE TERMINAL SHAPE TYPICAL |
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