AGLP030 datasheet(40/128 Pages) ACTEL

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IGLOO PLUS DC and Switching Characteristics

2- 26

R e v i sio n 1 1

The length of time an I/O can withstand IOSH/IOSL events depends on the junction temperature. The

reliability data below is based on a 3.3 V, 12 mA I/O setting, which is the worst case for this type of

analysis.

For example, at 100°C, the short current condition would have to be sustained for more than six months

to cause a reliability concern. The I/O design does not contain any short circuit protection, but such

protection would only be needed in extremely prolonged stress conditions.

Table 2-31 • Duration of Short Circuit Event before Failure

Temperature

Time before Failure

–40°C

> 20 years

0°C

> 20 years

25°C

> 20 years

70°C

5 years

85°C

2 years

100°C

6 months

Table 2-32 • Schmitt Trigger Input Hysteresis

Hysteresis Voltage Value (Typ.) for Schmitt Mode Input Buffers

Input Buffer Configuration

Hysteresis Value (typ.)

3.3 V LVTTL/LVCMOS (Schmitt trigger mode)

240 mV

2.5 V LVCMOS (Schmitt trigger mode)

140 mV

1.8 V LVCMOS (Schmitt trigger mode)

80 mV

1.5 V LVCMOS (Schmitt trigger mode)

60 mV

1.2 V LVCMOS (Schmitt trigger mode)

40 mV

Table 2-33 • I/O Input Rise Time, Fall Time, and Related I/O Reliability

Input Buffer

Input Rise/Fall

Time (min.)

Input Rise/Fall Time

(max.)

Reliability

LVTTL/LVCMOS (Schmitt trigger

disabled)

No requirement

10 ns *

20 years (100°C)

LVTTL/LVCMOS (Schmitt trigger

enabled)

No requirement

No requirement, but

input noise voltage

cannot exceed Schmitt

hysteresis.

20 years (100°C)

* The maximum input rise/fall time is related to the noise induced into the input buffer trace. If the noise is

low, then the rise time and fall time of input buffers can be increased beyond the maximum value. The

longer the rise/fall times, the more susceptible the input signal is to the board noise. Actel recommends

signal integrity evaluation/characterization of the system to ensure that there is no excessive noise

coupling into input signals.

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