3

Parameter

Maximum Rating

Units

300

mA

20

mA

30

mA

Power Dissipation

87

mW

5

V

Transient Forward Current (10

500

mA

Operating Temperature Range

-20 to +100

°C

Storage Temperature Range

-55 to +100

°C

Wave Soldering Temperature [1.59 mm (0.063 in.) from body]

250

°C for 3 seconds

Lead Solder Dipping Temperature [1.59 mm (0.063 in.) from body]

260

°C for 5 seconds

Notes:

2. Refer to Figure 6 to establish pulsed operating conditions.

3. Derate linerally as shown in Figure 5.

4. The transient peak current is the maximum non-recurring peak current the device can withstand without damaging the LED die and

wire bonds. It

is not recommended that the device be operated at peak currents beyond the Absolute Maximum Peak Forward Current.

Symbol

Description

Min.

Typ.

Max.

Unit

Test Condition

Forward Voltage

1.8

2.2

V

20 mA

Reverse Breakdown Voltage

5.0

15.0

V

λ

PEAK

Peak Wavelength

650

nm

Measurement at peak

λ

d

Dominant Wavelength

642

nm

Note 1

2

Spectral Line Halfwidth

20

nm

τs

Speed of Response

30

ns

Exponential Time

C

Capacitance

30

pF

θjc

Thermal Resistance

220

°C/W

Junction to Cathode Lead

ηv

Luminous Efficacy

80

1 m/W

Note 2

Notes:

1. The dominant wavelength,

λd, is derived from the CIE chromaticity diagram and represents the color of the device.

2. The radiant intensity, Ie, in watts per steradian, may be found from the equation Ie = Iv/

ηv, where Iv is the luminous intensity in candelas and ηv is

luminous efficacy in lumens/watt.

3. The approximate total luminous flux output within a cone angle of 2

θ about the optical axis, φv(2θ), may be obtained from the following formula:

φv(2θ) = [φv(θ)/Iv(0)]Iv; Where: φv(θ)/Iv(0) is obtained from Figure 7.