TLE4943C datasheet(44/48 Pages) INFINEON

44 / 48 page

TLE4943C

Data Sheet

V 1.2, July 2018

Package Information

Pure tin covering (green lead plating) is used. Lead frame material is copper based, e.g. K62. Product is RoHS

(Restriction of Hazardous Substances) compliant and marked with the letter G in front of the data code marking

and contains a data matrix code on the rear side of the package. Please refer to your key account team or regional

sales if you need further information.

Figure 30

Distance chip to upper side of IC

5.1

Lead Pull Out Force

The lead pull out force according IEC 60068-2-21 (fifth edition 1999-1) is 10N for each lead.

5.2

Glass Transition Temperature (TG)

Typical glass transition temperature is 165°C (minimum 160°C) measured according dynamic-mechanical-

analysis (DMA). The glass transition temperature can not be measured in production as separate test vehicle is

needed for DMA. Material properties are covered by process parameters and handling instruction for post mold

curing.

The typical glass transition temperature is 165°C according DSC method. A TG measurement according DMA on

test vehicle for every incoming material batch is carried out.

d=0.3±0.08mm

Distance chip to front side

(date code) of IC

TLE4943C 数据表(PDF) 44 Page - Infineon Technologies AG