DS12548 Rev 3

13/20

L5050S

Package and PCB thermal data

19

4

Package and PCB thermal data

Figure 21. SO-8 PC board

Layout condition of Rth and Zth measurements (PCB: double layer; FR4 area = 77 mm x 86

mm; PCB thickness = 1.6 mm; Cu thickness = 70 µm (front and back side); Cu thickness on

vias of 0.025 mm in PCB with a dissipation area of 2cm2 (picture on the right).

Figure 22. Rthj-amb vs PCB copper area in open box free air condition