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SMA6T12CAY 数据表(PDF) 5 Page - STMicroelectronics |
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SMA6T12CAY 数据表(HTML) 5 Page - STMicroelectronics |
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5 / 13 page ![]() Figure 9. Leakage current versus junction temperature I (nA ) R 1.E+00 1.E+01 1.E+02 1.E+03 1.E+04 25 50 75 100 125 150 VR=VRM VRM > 10 V VRM ≤ 10 V T (°C) j Figure 10. Peak forward voltage drop versus peak forward current IFM(A) 1.E-02 1.E-01 1.E+00 1.E+01 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 1.3 1.4 Tj=25 °C Tj=125 °C VFM(V) Figure 11. Relative variation of thermal impedance, junction to ambient, versus pulse duration Zth (j-a)/Rth (j-a) 0.01 0.10 1.00 1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03 s tp Printed circuit board FR4, copper surface = 1 cm2 Figure 12. Thermal resistance junction to ambient versus copper surface under each lead 0 50 100 150 200 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 Rth(j-a) (°C/W) SCu (cm²) Single pulse on recommended footprint.Epoxy printed circuit board FR4, 70 µm Cu thickness Figure 13. ISO7637-2 pulse 1: Vs = -150 V with 12 V battery 5 A /div 500 µs /div SMA6T30CAY SMA6T30AY 10 V/div Figure 14. ISO7637-2 pulse 2a: Vs = +112 V with 12 V battery 10 V/div 10 µs /div 10 A /div SMA6T30CAY SMA6T30AY SMA6TY Characteristics (curves) DS6931 - Rev 8 page 5/13 |
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