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AXE534127D 数据表(PDF) 3 Page - Panasonic Semiconductor

部件名 AXE534127D
功能描述  Narrow pitch connectors
PDF  13 Pages
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制造商  PANASONIC [Panasonic Semiconductor]
网页  http://www.panasonic.com/industrial/
标志 PANASONIC - Panasonic Semiconductor

AXE534127D 数据表(HTML) 3 Page - Panasonic Semiconductor

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Narrow pitch connectors A4S (0.4 mm pitch)
Panasonic Corporation Electromechanical Control Business Division
industrial.panasonic.com/ac/e/
ACCTB7E 202003
Panasonic Corporation 2020
Material and surface treatment
Part name
Material
Surface treatment
Molded portion
LCP resin (UL94V-0)
Contact and Post
Copper alloy
Contact portion: Base: Ni plating Surface: Au plating
Terminal portion: Base: Ni plating Surface: Au plating (except the terminal tips)
The socket terminals close to the portion to be soldered have nickel barriers
(exposed nickel portions).
Soldering terminals
Copper alloy
Sockets:
Base: Ni plating, Surface: Pd + Au flash plating (except the terminal tips)
Headers:
Base: Ni plating, Surface: Au plating (except the terminal tips)
Characteristics
Item
Specifications
Conditions
Electrical
characteristics
Rated current
0.3 A/pin contact (Max. 5 A at total pin contacts)
Rated voltage
60 V AC/DC
Dielectric strength
150 V AC for 1 min.
No short-circuiting or damage at a detection current of
1 mA when the specified voltage is applied for one minute.
Insulation resistance
Min. 1,000 MΩ (initial)
Using 250 V DC megger (applied for 1 min.)
Contact resistance
Max. 90 mΩ
Based on the contact resistance measurement method
specified by JIS C 5402.
Mechanical
characteristics
Composite insertion
force
Max. 1.200 N/pin contact × pin contacts (initial)
Composite removal
force
Min. 0.165 N/pin contact × pin contacts
Environmental
characteristics
Ambient temperature
–55 to +85°C
No icing. No condensation.
Soldering heat
resistance
The initial specification must be satisfied electrically
and mechanically.
Reflow soldering:
Peak temperature: 260°C or less
(on the surface of the PC board around the connector
terminals)
Soldering iron: 300°C within 5 sec. 350°C within 3 sec.
Storage temperature
–55 to +85°C (product only)
–40 to +50°C (emboss packing)
No icing. No condensation.
Thermal shock
resistance
(header and socket
mated)
5 cycles,
insulation resistance Min. 100 MΩ,
contact resistance Max. 90 mΩ
Temperature ()
Order
Time (minutes)
1
2
3
4
30
Max. 5
30
Max. 5
Conformed to MIL-STD-202F, method 107G
+3
0
55
85
55
0
3
0
3
Humidity resistance
(header and socket
mated)
120 hours,
insulation resistance Min. 100 MΩ,
contact resistance Max. 90 mΩ
Conformed to IEC60068-2-78
Temperature 40±2°C, humidity 90 to 95% RH
Saltwater spray
resistance
(header and socket
mated)
24 hours,
insulation resistance Min. 100 MΩ,
contact resistance Max. 90 mΩ
Conformed to IEC60068-2-11
Temperature 35±2°C, saltwater concentration 5±1%
H2S resistance (header
and socket mated)
48 hours,
contact resistance Max. 90 mΩ
Temperature 40±2°C, gas concentration 3±1 ppm,
humidity 75 to 80% RH
Lifetime
characteristics
Insertion and removal
life
30 times
Repeated insertion and removal speed of Max. 200
times/hour
Unit weight
20 pins Socket: 0.02 g Header: 0.01 g
SPECIFICATIONS
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