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STM32L552CEU6PTR 数据表(PDF) 317 Page - STMicroelectronics |
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STM32L552CEU6PTR 数据表(HTML) 317 Page - STMicroelectronics |
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317 / 340 page ![]() DS12737 Rev 6 317/340 STM32L552xx Package information 333 6.4 WLCSP81 package information WLCSP81 is a 81-ball, 4.36 x 4.07 mm, 0.4 mm pitch, wafer level chip scale package. Figure 85. WLCSP81 outline 1. Drawing is not to scale. 2. Dimension is measured at the maximum bump diameter parallel to primary datum Z. 3. Primary datum Z and seating plane are defined by the spherical crowns of the bump. 4. Bump position designation per JESD 95-1, SPP-010. Table 156. WLCSP81 mechanical data Symbol millimeters inches(1) Min Typ Max Min Typ Max A(2) - - 0.59 - - 0.023 A1 - 0.18 - - 0.007 - A2 - 0.38 - - 0.015 - A3(3) - 0.025 - - 0.001 - b 0.22 0.25 0.28 0.009 0.010 0.011 D 4.33 4.36 4.39 0.170 0.172 0.173 E 4.05 4.07 4.09 0.159 0.160 0.161 B01H_WLCSP81_ME_V1 D E A1 BALL LOCATION e e e2 e1 F G (4x) aaa A A2 bbb Z A1 A3 A2 b Z eee Z b(81x) ccc ZX Y ddd Z SEATING PLANE FRONT VIEW TOP VIEW BOTTOM VIEW SIDE VIEW DETAIL A DETAIL A ROTATED 90 BUMP |
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