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STM32L552CEU6PTR 数据表(PDF) 331 Page - STMicroelectronics

部件名 STM32L552CEU6PTR
功能描述  Ultra-low-power Arm® Cortex®-M33 32-bit MCUTrustZone®FPU, 165 DMIPS, up to 512 KB Flash memory, 256 KB SRAM, SMPS
PDF  340 Pages
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制造商  STMICROELECTRONICS [STMicroelectronics]
网页  http://www.st.com
标志 STMICROELECTRONICS - STMicroelectronics

STM32L552CEU6PTR 数据表(HTML) 331 Page - STMicroelectronics

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DS12737 Rev 6
331/340
STM32L552xx
Package information
333
6.8.1
Reference document
JESD51-2 Integrated Circuits Thermal Test Method Environment Conditions - Natural
Convection (Still Air). Available from www.jedec.org
6.8.2
Selecting the product temperature range
When ordering the microcontroller, the temperature range is specified in the ordering
information scheme shown in Section 7: Ordering information.
Each temperature range suffix corresponds to a specific guaranteed ambient temperature at
maximum dissipation and, to a specific maximum junction temperature.
ΘJC
Thermal resistance junction-case
LQFP144 20 x 20 mm
13.5
°C/W
Thermal resistance junction-case
LQFP100 - 14 × 14 mm
14
Thermal resistance junction-case
LQFP64 10 x 10 mm
14.2
Thermal resistance junction-case
LQFP48 7 x 7 mm
14.4
Thermal resistance junction-case
UFQFPN48 7 x 7 mm
1.5
Thermal resistance junction-case
UFBGA132 7 x 7 mm
38.1
Thermal resistance junction-case
WLCSP81 4.36 x 4.07 mm
1.5
ΘJB
Thermal resistance junction-board
LQFP144 20 x 20 mm
43.3
°C/W
Thermal resistance junction-board
LQFP100 - 14 × 14 mm
41.5
Thermal resistance junction-board
LQFP64 10 x 10 mm
39.5
Thermal resistance junction-board
LQFP48 7 x 7 mm
37.4
Thermal resistance junction-board
UFQFPN48 7 x 7 mm
13.5
Thermal resistance junction-board
UFBGA132 7 x 7 mm
13.2
Thermal resistance junction-board
WLCSP81 4.36 x 4.07 mm
27
Table 162. Package thermal characteristics (continued)
Symbol
Parameter
Value
Unit



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