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VS6650S02F/T2 数据表(PDF) 1 Page - STMicroelectronics |
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VS6650S02F/T2 数据表(HTML) 1 Page - STMicroelectronics |
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1 / 3 page ![]() 1/3 DATA BRIEF October 2004 VS6650 1.0 Megapixel SMIA Camera Module Rev. 1 FEATURES ■ 1.0 Megapixel resolution (1152H x 864V) ■ SMIA 1 1.0 profile 1 compliant imager ■ CCP 2.0 serial video interface ■ Two-wire control port (CCI) ■ On-chip PLL based on 13 MHz system clock ■ Up to 30 frame per second (fps) progressive scan, with smooth frame rate control ■ Horizontal downscale from 1x to 4.5x in 1/16 steps ■ Operation from 2.4 V analog power supply ■ Low EMI 1.8 V digital and I/O power supply ■ 30 µW power-down consumption ■ 10-bit on-chip ADC ■ Small size 1/3 inch lens fixed focus module ■ Integral EMC shielding DESCRIPTION The VS6650 is a 1.0 Megapixel camera module for use across a range of mobile phone platforms. The camera module, which is SMIA 1.0 profile 1 compliant, can generate 1.0 Megapixel images up to 30 fps. Based on the SMIA architectural concepts, the VS6650 can be used with or without image pro- cessor (i.e. STV0976 or STV0984). The module is suitable for performance-driven camera phones and cost-driven high volume designs. The embed- ded horizontal scaler typically enables the realiza- tion of power-efficient viewfinder that uses host software processing. For performance driven ap- plications or when a different video interface is re- quired, the STV0976 mobile imaging processor ensures state-of-the-art image reconstruction and compression at up to 15 fps. The VS6650 features allow straightforward inte- gration into mobile phone designs: low EMI video interface and package/socket shielding, low wire count (8 total), embedded power management (30 µW power-down) and embedded PLL. A minimal list of external components is required: supply de- coupling capacitors, CCI pull-ups and a charge- pump capacitor. The VS6650 3-element lens design ensures high quality image capture while maintaining low mod- ule height. The overall optical stack, including lens system, IR filter and sensor optical structures is developed within ST. The VS6650 package uses the second generation of SmOP2 packaging technology. Sensor and lens are assembled in a fully automated test and focus process for high volume and low cost production. This 1.0 Megapixel sensor fits within the SMIA95 form factor (9.5 x 9.5 x 7.6 mm3). APPLICATIONS ■ Mobile phone ■ PDA ■ Wireless security camera Table 1. Order Codes 1.Standard Mobile Imaging Architecture, visit www.smia-forum.org Part Number Description VS6650S02F/T2 SmOP2 SMIA95 22” tape and reel |
类似零件编号 - VS6650S02F/T2 |
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类似说明 - VS6650S02F/T2 |
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