3M™ Scotch-Weld™ Toughened Epoxy Adhesive LSB60

Typical Physical Properties

Conditions

Attribute Modi er: Cured

Typical Cured Characteristics

Conditions

Dwell/Cure Time: 60 min @ Room Temperature

Methods

ASTM D2240

Typical Performance Characteristics

Property Values

Method

Attribute

Modi er

Substrate

Failure

mode

Surface

Preparation Notes

90°

Peel

Adhesion

3700

N/cm

ASTM

D3330

(modi ed)

Non-

Linered

Cushioned

Sleeve A

CF/AF

Honeycomb

Climbing

Drum

Peel

56.5 lbf-

in/in

15.9 lbf-

in/in

ASTM

D1781

Aluminum

to

Aluminum

MEK/Abrade/MEK

¼” core cell (partial core failure)

Bell Peel

Test Condition

Failure mode

3.6 lb/in width

@ -67°F(-55°C)

CF

13.3 lb/in width

Room Temperature

AF

15.9 lb/in width

4 hr @ 180°F(82°C)

AF

Property: Bell Peel

Method: ASTM D3167

Substrate: Etched Aluminum

Substrate Notes: 0.02in thick; 0.065in bondline

notes: Bell peel strengths were measured on 1 in. wide bonds at the temperatures noted. The testing jaw separation rate was 6 in. per minute. AF: adhesive failure

CF: cohesive failure SF: substrate failure

Table continued on next page

Overlap

Shear

Strength

Dwell/Cure

Time

Dwell

Time

Units

Temp

C

Temp

F

Environmental

ConditionSubstrate

Substrate

Notes

Surface

Preparation

Failure

mode

Notes

Test

Condition

3600

lb/in²

7

days

23C

73F

52%RH Aluminum0.005-

0.008in

bondline

MEK/Abrade/MEK

CF

Overlap shear (OLS) strengths were measured on 1 in.

wide 1/2 in. overlap specimens. These bonds were made

individually using 1 in. x 4 in. pieces of substrate except

for aluminum. Two panels 0.063 in. thick, 4 in. x 7 in. of

2024T-3 clad aluminum were bonded and cut into 1 in.

wide samples after 24 hours.

The separation rate of the testing jaws was 0.1 in. per

minute for metals, 2 in. per minute for plastics and 20 in.

per minute for rubbers. The thickness of the substrates

were: steel, 0.060 in.; other metals, 0.05-0.064 in.;

rubbers, 0.125 in.; plastics, 0.125 in.

Cohesive Failure (CF), Adhesive Failure (AF), Substrate

Failure (SF)