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AF3002 数据表(PDF) 2 Page - 3M Electronics |
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AF3002 数据表(HTML) 2 Page - 3M Electronics |
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2 / 7 page ![]() Scotch-WeldTM Core Splice Adhesive Film AF 3002 - 2 - Product Performance Note: The following technical information and data should be considered representative or typical only and should not be used for specification purposes. 1. Cured Density: The free film cured density for 3M™ Scotch-Weld™ Core Splice Adhesive Film AF 3002 has been determined using the specific gravity method outlined in 3M Test Method C-2310-2. Cure Cycle A: 250°F (121°C) – 0 psig – 60 min. – 10°F/min. warmup. Cured Density: 40 lbs./cubic foot (approx.). Cure Cycle B: 350°F (177°C) – 0 psig – 60 min. – 10°F/min. warmup. Cured Density: 35 lbs./cubic foot (approx.). 2. Per Cent Expansion During Cure: The free film per cent volume expansion during cure for Scotch-Weld AF 3002 has been determined from the change in specific gravity in going from the uncured to the cured state as outlined in 3M Test Method C-276. Cure Cycle A: 250°F (121°C) – 0 psig – 60 min. – 10°F/min. warmup. Per Cent Volume Expansion: 35% (approx.). Cure Cycle B: 350°F (177°C) – 0 psig – 60 min. – 10°F/min. warmup. Per Cent Volume Expansion: 55% (approx.). 3. Splice Delamination Strength: Splice delamination strength has been determined on Scotch-Weld AF 3002 in accordance with the procedure outlined in MIL-C-7438F para. 4.7.9. Core: 5052 alloy – 1/4" cell – 0.004" foil – 5/8" thick – nonperforated. Specimen: 5" x 10" (core ribbon perpendicular to ten inch dimension). Splice Position: Centered and perpendicular to the 10" dimension running the full width of the specimen. No. of layers: Two (for smaller cell sizes single layers of film are suggested). Load Rate: 0.25"/minute. A. Cure Cycle: 250°F (121°C) – 0 psig – 60 min. – 10°F/min. warmup. B. Cure Cycle: 350°F (177°C) – 0 psig – 60 min. – 10°F/min. warmup. MIL-C-7438F Test Temperature Requirement Cure A strength Cure B strength 75°F (24°C) 40 lbs. 50-100 lbs. 50-100 lbs. Core failure Core failure Note: Width of range is a result of strength variation of core node bonds which normally fail at lower loads than the strength of the splice. |
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