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AF191 数据表(PDF) 7 Page - 3M Electronics |
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AF191 数据表(HTML) 7 Page - 3M Electronics |
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7 / 12 page ![]() - 7 - 3M™ Scotch-Weld™ Structural Adhesive Film AF 191 Technical Datasheet 12. Dynamic Mechanical Analysis 3M™ Scotch-Weld™ Structural Adhesive Film AF 191U .035 lb/ft2 (170 g/m2) cured under standard conditions. Specimen size: 11.7 x 10.2 x 1.5 mm. Test equipment: Dupont™ 1090 – Heating Rate: 20°C/minute Typical Product Performance (continued) Conditions After Cure Glass Transition Temp. Cure Characteristics Graph Key E' = Tensile Storage Modulus E" = Tensile Loss Modulus Dry 439°F (226°C) E' E" 20 Days, 90°F (33°C) 83% relative 424°F (218°C) E' humidity (1.42% water absorption) E" 20 Days, 120°F (49°C) 100% relative 374°F (190°C) E' humidity (2.8% water absorption) E" Temperature °C (°F) Note: The following technical information and data should be considered representative or typical only and should not be used for specification purposes. |
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