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T1035 数据表(PDF) 6 Page - STMicroelectronics |
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T1035 数据表(HTML) 6 Page - STMicroelectronics |
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6 / 12 page ![]() 2 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. 2.1 D²PAK package information Figure 12. D²PAK package outline e G E1 E2 c2 A b b2 E V2 c A1 A2 A3 R Gauge Plane 1 2 3 Max resin gate protrusion: 0.5 mm (1) (1) Resin gate is accepted in each of position shown on the drawing, or their symmetrical. Table 6. D²PAK package mechanical data Ref. Dimensions Millimeters Inches(1) Min. Typ. Max. Min. Typ. Max. A 4.30 4.60 0.1693 0.1811 A1 2.49 2.69 0.0980 0.1059 A2 0.03 0.23 0.0012 0.0091 A3 0.25 0.0098 b 0.70 0.93 0.0276 0.0366 b2 1.25 1.7 0.0492 0.0669 BTA10, BTB10, T1035, T1050 Package information DS3165 - Rev 9 page 6/12 |
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