TLV9152SIRUGR datasheet(12/72 Pages) TI

12 / 72 page

6.4 Thermal Information for Single Channel (continued)

THERMAL METRIC (1)

TLV9151, TLV9151S

UNIT

DBV

(SOT-23)

DCK

(SC70)

DRL (2)

(SOT-553)

5 PINS

6 PINS

5 PINS

6 PINS

RθJC(bot)

Junction-to-case (bottom) thermal resistance

N/A

TBD

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

(2)

This package option is preview for TLV9151.

6.5 Thermal Information for Dual Channel

THERMAL METRIC (1)

TLV9152, TLV9152S

UNIT

(SOIC)

DDF

(SOT-23-8)

DGK (2)

(VSSOP)

DGS (2)

(VSSOP)

DSG

(WSON)

(TSSOP)

RUG

(X2QFN)

8 PINS

10 PINS

8 PINS

10 PINS

RθJA

Junction-to-ambient

thermal resistance

138.7

143.5

176.5

TBD

77.6

185.1

142.3

°C/W

Rθ

JC(top)

Junction-to-case (top)

thermal resistance

78.7

79.9

68.1

TBD

93.7

74.0

53.5

°C/W

RθJB

Junction-to-board

thermal resistance

82.2

61.6

98.2

TBD

43.9

115.7

68.5

°C/W

ψJT

Junction-to-top

characterization

parameter

27.8

5.7

12.0

TBD

4.4

12.3

1.0

°C/W

ψJB

Junction-to-board

characterization

parameter

81.4

61.3

96.7

TBD

43.9

114.0

68.4

°C/W

Rθ

JC(bot)

Junction-to-case

(bottom) thermal

resistance

N/A

TBD

19.0

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

(2)

This package option is preview for TLV9152.

6.6 Thermal Information for Quad Channel

THERMAL METRIC (1)

TLV9154, TLV9154S

UNIT

(SOIC)

(TSSOP)

RTE (2)

(WQFN)

RUC

(WQFN)

14 PINS

16 PINS

14 PINS

RθJA

Junction-to-ambient thermal resistance

101.4

131.4

TBD

125.9

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

57.6

51.8

TBD

39.8

°C/W

RθJB

Junction-to-board thermal resistance

57.3

75.8

TBD

68.0

°C/W

ψJT

Junction-to-top characterization parameter

18.5

7.9

TBD

0.8

°C/W

ψJB

Junction-to-board characterization

parameter

56.9

74.8

TBD

67.8

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal

resistance

N/A

TBD

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

(2)

This package option is preview for TLV9154.

TLV9151, TLV9152, TLV9154

SBOS986C – OCTOBER 2019 – REVISED DECEMBER 2020

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