数据搜索系统,热门电子元器件搜索
  Chinese  ▼
ALLDATASHEETCN.COM

X  

VIPER318LDTR 数据表(PDF) 30 Page - STMicroelectronics

部件名 VIPER318LDTR
功能描述  Energy saving offline high voltage converter
PDF  40 Pages
Scroll/Zoom Zoom In 100%  Zoom Out
制造商  STMICROELECTRONICS [STMicroelectronics]
网页  http://www.st.com
标志 STMICROELECTRONICS - STMicroelectronics

VIPER318LDTR 数据表(HTML) 30 Page - STMicroelectronics

Back Button VIPER318LDTR Datasheet HTML 26Page - STMicroelectronics VIPER318LDTR Datasheet HTML 27Page - STMicroelectronics VIPER318LDTR Datasheet HTML 28Page - STMicroelectronics VIPER318LDTR Datasheet HTML 29Page - STMicroelectronics VIPER318LDTR Datasheet HTML 30Page - STMicroelectronics VIPER318LDTR Datasheet HTML 31Page - STMicroelectronics VIPER318LDTR Datasheet HTML 32Page - STMicroelectronics VIPER318LDTR Datasheet HTML 33Page - STMicroelectronics VIPER318LDTR Datasheet HTML 34Page - STMicroelectronics Next Button
Zoom Inzoom in Zoom Outzoom out
 30 / 40 page
background image
5.3
Layout guidelines and design recommendations
A proper printed circuit board layout is essential for correct operation of any switch-mode converter and this is
true for the VIPer as well. The main reasons to have a proper PCB layout are to:
Provide clean signals to the IC, ensuring good immunity against external noises and switching noises
Reduce the electromagnetic interferences, both radiated and conducted, to pass more easily the EMC
When designing an SMPS using VIPer, the following basic rules should be considered:
Separating signal from power tracks: generally, traces carrying signal currents should run far from those
carrying pulsed currents or with quickly swinging voltages. Signal ground traces should be connected to the
IC signal ground, GND, using a single “star point”, placed close to the IC. Power ground traces should be
connected to the IC power ground, GND. The compensation network should be connected to the COMP,
maintaining the trace to GND as short as possible. In case of two layer PCB, it is a good practice to route
signal traces on one PCB side and power traces on the other side.
Filtering sensitive pins: some crucial points of the circuit need or may need filtering. A small high-
frequency bypass capacitor to GND might be useful to get a clean bias voltage for the signal part of the
IC and protect the IC itself during EFT/ESD tests. A low ESL ceramic capacitor (a few hundreds pF up to
0.1 μF) should be connected across VCC and GND, placed as close as possible to the IC. With flyback
topologies, when the auxiliary winding is used, it is suggested to connect the VCC capacitor on the auxiliary
return and then to the main GND using a single track.
Keep power loops as confined as possible: minimize the area circumscribed by current loops where high
pulsed currents flow, in order to reduce its parasitic self-inductance and the radiated electromagnetic field:
this greatly reduces the electromagnetic interferences produced by the power supply during the switching. In
a flyback converter the most critical loops are: the one including the input bulk capacitor, the power switch,
the power transformer, the one including the snubber, the one including the secondary winding, the output
rectifier and the output capacitor. In a buck converter the most critical loop is the one including the input bulk
capacitor, the power switch, the power inductor, the output capacitor and the free-wheeling diode.
Reduce line lengths: any wire acts as an antenna. With the very short rise times exhibited by EFT pulses,
any antenna has the capability of receiving high-voltage spikes. By reducing line lengths, the level of
radiated energy that is received is reduced, and the resulting spikes from electrostatic discharges are lower.
This also keeps both resistive and inductive effects to a minimum. In particular, all of the traces carrying high
currents, especially if pulsed (tracks of the power loops) should be as short and fat as possible.
Optimize track routing: as levels of pickup from static discharges are likely to be greater closer to the
extremities of the board, it is wise to keep any sensitive lines away from these areas. Input and output lines
often need to reach the PCB edge at some stage, but they can be routed away from the edge as soon
as possible where applicable. Since vias are to be considered inductive elements, it is recommended to
minimize their number in the signal path and avoid them when designing the power path.
Improve thermal dissipation: an adequate copper area has to be provided under the DRAIN pins as heat
sink, while it is not recommended to place large copper areas on the GND.
VIPER31
Layout guidelines and design recommendations
DS13285 - Rev 3
page 30/40



Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40


数据表 下载

Go To PDF Page


链接网址



ALLDATASHEET是否为您带来帮助?  [ DONATE ] 

关于 Alldatasheet   |   广告服务   |   联系我们   |   隐私政策   |   数据表链接    |   链接交换   |   制造商名单
All Rights Reserved©Alldatasheet.com


Mirror Sites
English : Alldatasheet.com  |   English : Alldatasheet.net  |   Chinese : Alldatasheetcn.com  |   German : Alldatasheetde.com  |   Japanese : Alldatasheet.jp
Russian : Alldatasheetru.com  |   Korean : Alldatasheet.co.kr  |   Spanish : Alldatasheet.es  |   French : Alldatasheet.fr  |   Italian : Alldatasheetit.com
Portuguese : Alldatasheetpt.com  |   Polish : Alldatasheet.pl  |   Vietnamese : Alldatasheet.vn
Indian : Alldatasheet.in  |   Mexican : Alldatasheet.com.mx  |   British : Alldatasheet.co.uk  |   New Zealand : Alldatasheet.co.nz
Family Site : ic2ic.com  |   icmetro.com