SMD1812 Series

Solder reflow conditions

Profile Feature

Pb-Free Assembly

Average ramp-up rate (TS maxto TP)

3℃/second max.

Preheat

-Temperature Min (TS min)

-Temperature Max (TS max)

-Time (min to max) (TS min to TS max)

150℃

200℃

60-180 seconds

Time maintained above:

-Temperature (TL)

-Time (tL)

217℃

60-150 seconds

Peak Temperature (TP)

260℃

Time within 5℃of actual PeakTemperature (tP)

20-40 seconds

Ramp-down Rate

3℃/second max.

Time 25℃to Peak Temperature

8 minutes max.

StorageCondition

0℃~35℃, ≤70%RH

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Recommended maximum paste thickness is 0.25mm (0.010 inch)

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Device can be cleaned using standard industry methods and solvents.

Note1: All temperature refer to topside of the package, measured on the package body surface.

Note 2: If reflow temperatures exceed the recommended profile, devices may not meet the performance

Requirements

Specifications are subject to change without notice

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HUAAN LIMITED

www.huaandz.com

Email: sales@huaandz.com