数据搜索系统,热门电子元器件搜索
  Chinese  ▼
ALLDATASHEETCN.COM

X  

SSWM41DI2 数据表(PDF) 21 Page - Seoul Semiconductor

部件名 SSWM41DI2
功能描述  Side View LED
PDF  22 Pages
Scroll/Zoom Zoom In 100%  Zoom Out
制造商  SEOUL [Seoul Semiconductor]
网页  http://www.seoulsemicon.com
标志 SEOUL - Seoul Semiconductor

SSWM41DI2 数据表(HTML) 21 Page - Seoul Semiconductor

Back Button SSWM41DI2 Datasheet HTML 14Page - Seoul Semiconductor SSWM41DI2 Datasheet HTML 15Page - Seoul Semiconductor SSWM41DI2 Datasheet HTML 16Page - Seoul Semiconductor SSWM41DI2 Datasheet HTML 17Page - Seoul Semiconductor SSWM41DI2 Datasheet HTML 18Page - Seoul Semiconductor SSWM41DI2 Datasheet HTML 19Page - Seoul Semiconductor SSWM41DI2 Datasheet HTML 20Page - Seoul Semiconductor SSWM41DI2 Datasheet HTML 21Page - Seoul Semiconductor SSWM41DI2 Datasheet HTML 22Page - Seoul Semiconductor  
Zoom Inzoom in Zoom Outzoom out
 21 / 22 page
background image
www.seoulsemicon.com
Product Data Sheet
SSWM41DI2 –Side View LED
22
Rev1.0, November 22, 2019
Precaution for Use
b. EOS (Electrical Over Stress)
Electrical Over-Stress (EOS) is defined as damage that may occur when an electronic device is
subjected to a current or voltage that is beyond the maximum specification limits of the device.
The effects from an EOS event can be noticed through product performance like:
- Changes to the performance of the LED package
(If the damage is around the bond pad area and since the package is completely encapsulated
the package may turn on but flicker show severe performance degradation.)
- Changes to the light output of the luminaire from component failure
- Components on the board not operating at determined drive power
Failure of performance from entire fixture due to changes in circuit voltage and current across total
circuit causing trickle down failures. It is impossible to predict the failure mode of every LED exposed
to electrical overstress as the failure modes have been investigated to vary, but there are some
common signs that will indicate an EOS event has occurred:
- Damaged may be noticed to the bond wires (appearing similar to a blown fuse)
- Damage to the bond pads located on the emission surface of the LED package
(shadowing can be noticed around the bond pads while viewing through a microscope)
- Anomalies noticed in the encapsulation and phosphor around the bond wires.
- This damage usually appears due to the thermal stress produced during the EOS event.
c. To help minimize the damage from an EOS event Seoul Semiconductor recommends utilizing:
- A surge protection circuit
- An appropriately rated over voltage protection device
- A current limiting device



Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22


数据表 下载

Go To PDF Page


链接网址



ALLDATASHEET是否为您带来帮助?  [ DONATE ] 

关于 Alldatasheet   |   广告服务   |   联系我们   |   隐私政策   |   数据表链接    |   链接交换   |   制造商名单
All Rights Reserved©Alldatasheet.com


Mirror Sites
English : Alldatasheet.com  |   English : Alldatasheet.net  |   Chinese : Alldatasheetcn.com  |   German : Alldatasheetde.com  |   Japanese : Alldatasheet.jp
Russian : Alldatasheetru.com  |   Korean : Alldatasheet.co.kr  |   Spanish : Alldatasheet.es  |   French : Alldatasheet.fr  |   Italian : Alldatasheetit.com
Portuguese : Alldatasheetpt.com  |   Polish : Alldatasheet.pl  |   Vietnamese : Alldatasheet.vn
Indian : Alldatasheet.in  |   Mexican : Alldatasheet.com.mx  |   British : Alldatasheet.co.uk  |   New Zealand : Alldatasheet.co.nz
Family Site : ic2ic.com  |   icmetro.com