TITLE

DRAWING NO. REV.

32D6, 32-lead, 0.600" Wide, Non-windowed,

Ceramic Dual Inline Package (Cerdip)

B

32D6

10/23/03

42.70(1.68)

41.70(1.64)

PIN

1

15.50(0.610)

13.00(0.510)

2.49(0.098)MAX

0.127(0.005)MIN

1.52(0.060)

0.38(0.015)

0.58(0.023)

0.36(0.014)

1.65(0.065)

1.14(0.045)

15.70(0.620)

15.00(0.590)

17.80(0.700) MAX

0.381(0.015)

0.203(0.008)

2.54(0.100)BSC

5.08(0.200)

3.18(0.125)

SEATING

PLANE

5.72(0.225)

MAX

38.10(1.500) REF

0º~ 15º REF

Dimensions in Millimeters and (Inches).

Controlling dimension: Inches.

MIL-STD 1835 D-16 Config A

Note: 

For the most current package drawings, please see the Microchip Packaging Specification located at http://

www.microchip.com/packaging.

AT28C010

Packaging Information

DS20006311A-page 22