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MX55 数据表(PDF) 13 Page - Microchip Technology |
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MX55 数据表(HTML) 13 Page - Microchip Technology |
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13 / 28 page ![]() 2018 Microchip Technology Inc. DS20005972A-page 13 MX55/57 6.0 ENVIRONMENTAL SPECIFICATIONS TABLE 6-1: ENVIRONMENTAL SPECIFICATIONS Parameter Specification Thermal Shock MIL-STD-883, Method 1011, Condition A Moisture Resistance MIL-STD-883, Method1004 Mechanical Shock MIL-STD-883, Method 2022, Condition C Mechanical Vibration MIL-STD-883, Method 2007, Condition B Resistance to Soldering Heat J-STD-020C, Table 5-2 Pb-free Devices (Except 2 Cycles Max) Hazardous Substance Pb-Free/RoHS/Green Compliant Solderability JESD22-B102-D Method 2 (Preconditioning E) Terminal Strength MIL-STD-883, Method 2004, Test Condition D Gross Leak MIL-STD-883, Method 1014, Condition C Fine Leak MIL-STD-883, Method 1014, Condition A2, R1 = 2x10–8 ATM CC/S Solvent Resistance MIL-STD-202, Method 215 |
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