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MX555ABF 数据表(PDF) 5 Page - Microchip Technology |
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MX555ABF 数据表(HTML) 5 Page - Microchip Technology |
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5 / 28 page ![]() 2018 Microchip Technology Inc. DS20005972A-page 5 MX55/57 TEMPERATURE SPECIFICATIONS (Note 1) Parameters Sym. Min. Typ. Max. Units Conditions Temperature Ranges Operating Temperature Range TA –40 — 85 °C Ordering Option I Junction Operating Temperature TJ —— 125 °C — Storage Temperature Range TS –65 — 150 °C — Soldering Temperature — — — 260 °C 10 sec. max. Package Thermal Resistance Thermal Resistance from Junction to Ambient JA —53 °C/W 5 mm x 7 mm — 58 5 mm x 3.2 mm Note 1: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the thermal resistance from junction to air (i.e., TA, TJ, JA). Exceeding the maximum allowable power dissipation will cause the device operating junction temperature to exceed the maximum +125°C rating. Sustained junction temperatures above +125°C can impact the device reliability. |
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