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MCP3302-I/ST 数据表(PDF) 21 Page - Microchip Technology |
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MCP3302-I/ST 数据表(HTML) 21 Page - Microchip Technology |
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21 / 40 page ![]() 2002 Microchip Technology Inc. DS21697B-page 21 MCP3302/04 6.7 Utilizing the Digital and Analog Ground Pins The MCP3302/04 devices provide both digital and ana- log ground connections to provide another means of noise reduction. As shown in Figure 6-11, the analog and digital circuitry are separated internal to the device. This reduces noise from the digital portion of the device being coupled into the analog portion of the device. The two grounds are connected internally through the sub- strate which has a resistance of 5 -10 Ω. If no ground plane is utilized, then both grounds must be connected to VSS on the board. If a ground plane is available, both digital and analog ground pins should be connected to the analog ground plane. If both an analog and a digital ground plane are available, both the digital and the analog ground pins should be con- nected to the analog ground plane, as shown in Figure 6-11. Following these steps will reduce the amount of digital noise from the rest of the board being coupled into the A/D Converter. FIGURE 6-11: Separation of Analog and Digital Ground Pins. MCP3302/04 Analog Ground Plane DGND AGND VDD 0.1 µF Substrate 5 - 10 Ω Digital Side -SPI Interface -Shift Register -Control Logic Analog Side -Sample Cap -Capacitor Array -Comparator |
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