SEMICONDUCTOR

TECHNICAL DATA

MB2F ~ MB10F

2015. 08. 22

1/2

Revision No : 0

Case Style: MBF

Features

◆

Plastic package has Underwriters Laboratory

Flammability Classification 94V-0

◆

High surge current capability

◆

Ideal for printed circuit boards

◆

Glass passivated chip junction

Mechanical Data

Case: Molded plastic body over passivated junctions

Terminals: Plated leads solderable per MIL-STD-750,

Method 2026

High temperature soldering guaranteed:

260℃/20 seconds

Mounting Position: Any

Weight: 0.07oz., 0.2g

Dimensions in millimeters

MB2F

MB4F

MB6F

MB8F

MB10F

Unit

200

400

600

800

1000

V

140

280

420

560

700

V

200

400

600

800

1000

V

Maximum average forward output

current rectified (see Fig.1)

superimposed on rated load (JEDEC Method)

Rating for fusig (t<8.3ms)

A

pF

℃

℃

Maximum instantaneous forward voltage drop per leg at0.4A

V

Tj=25℃

Tj=125℃

Notes:

(1) On glass epoxy P.C B mounted on 0.05''×0.05''(1.3×1.3mm) pads

(2) On aluminum substrate P.C B.with an area of 0.8''×0.8" (20×20mm) mounted on 0.05''×0.05''(1.3×1.3mm)solder pad

μA

A

Symbol

Peak forward surge current single sine-wave

Maximum DC blocking voltage

A

0.8

(2)

30

℃/W

VF

IR

Parameter

Maximum repetitive peak reverse voltage

on glass-epoxy P.C.B.

on aluminum substrate

Maximum RMS voltage

CJ

Storage temperature range

Maximum DC reverse current at

rated DC blocking voltage per leg

Typical thermal resistance per leg

0.5

(1)

-55 to +150

-55 to +150

I

Typical junction capacitance per leg at 4.0V 1.0Mhz

Operating junction temperature range

85

(1)

3.7

1.00

5

100

70

(2)

20

(1)

13

_ +

~ ~

0.6±0.10

2.54±0.20

4.75±0.20

0.66±0.2

1.42±0.2

Min.0.58

2.54

GLASS PASSIVATED SINGLE-PHASE BRIDGE RECTIFIER

Reverse Voltage 200to1000 Volts ForwardCurrent 0.8 Amperes