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MB2M 数据表(PDF) 1 Page - First Silicon Co., Ltd |
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MB2M 数据表(HTML) 1 Page - First Silicon Co., Ltd |
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1 / 2 page ![]() a t a D l a c i n a h c e M s e r u t a e F s c i t s i r e t c a r a h C l a c i r t c e l E d n a s g n i t a R m u m i x a M (T A=25 oC unless otherwise noted) Plastic package has Underwriters Laboratory Flammability Classification 94V-0 Glass passivated chip junctions High surge overload rating: 35A peak Saves space on printed circuit boards High temperature soldering guaranteed: 260oC/10 seconds. Case: Molded plastic body over passivated junctions Terminals: Plated leads solderable per MIL-STD-750, Method 2026 Mounting Position: Any Weight: 0.078 oz., 0.22 g s r e i f i t c e R e g d i r B t n u o M e c a f r u S e s a h P - e l g n i S d e t a v i s s a P s s a l G e r u t a i n i M e r e p m A 5 . 0 t n e r r u C d r a w r o F s t l o V 0 0 0 1 o t 0 0 2 e g a t l o V e s r e v e R r e t e m a r a s P l o b m y S M 2 B M M 4 B M M 6 B M M 8 B M M 0 1 B M s t i n U e g a t l o v e s r e v e r k a e p e v i t i t e p e r m u m i x a V M M R R 0 0 2 0 0 4 0 0 6 0 0 8 0 0 0 1 s t l o V e g a t l o v S M R m u m i x a V M S M R 0 4 1 0 8 2 0 2 4 0 6 5 0 0 7 s t l o V e g a t l o v g n i k c o l b C D m u m i x a V M C D 0 0 2 0 0 4 0 0 6 0 0 8 0 0 0 1 s t l o V t n e r r u c d e i f i t c e r t u p t u o d r a w r o f e g a r e v a m u m i x a M . B . C . P y x o p e - s s a l g n o ) 1 . g i F e e s ( e t a r t s b u s m u n m u l a n o I ) V A ( F 5 . 0 ) 1 ( 8 . 0 ) 2 ( p m A e v a w - e n i s f l a h e l g n i s s m 3 . 8 t n e r r u c e g r u s d r a w r o f k a e P ) d o h t e M C E D E J ( d a o l d e t a r n o d e s o p m i r e p u s I M S F 0 . 5 s 3 p m A ) s m 3 . 8 < t ( g n i s u f r o f g n i t a I R 2 0 t . A 5 2 c e s A 4 . 0 t a g e l r e p p o r d e g a t l o v d r a w r o f s u o e n a t n a t s n i m u m i x a V M F 0 . t 1 l o V T t a t n e r r u c e s r e v e r C D m u m i x a M A 5 2 = oC T g e l r e p e g a t l o v g n i k c o l b C D d e t a r A 5 2 1 = oC I R 0 . 5 0 0 1 uA g e l r e p e c n a t s i s e r l a m r e h t l a c i p y T R θ A J R θ A J R θ L J 5 8 ) 1 ( 0 7 ) 2 ( 0 2 ) 1 ( o W / C z H M 0 . 1 , V 0 . 4 t a g e l r e p e c n a t i c a p a c n o i t c n u j l a c i p y C T J 3 1 pF e g n a r e r u t a r e p m e t e g a r o t s d n a n o i t c n u j g n i t a r e p T O J T , G T S 0 5 1 + o t 5 5 - oC Notes 1. On glass epoxy P.C B. mounted on 0.05 x 0.05" (1.3 x 1 3mm) pads 2. On aluminum substrate P.C.B. with an area of 0 8" x 0 8" (20 x 20mm) mounted on 0.05 x 0.05" (1.3 x 1 3mm) solder pad SEMICONDUCTOR TECHNICAL DATA MB2M ~ MB10M 2010 10 10 1/2 Revision No : 0 |
类似零件编号 - MB2M |
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类似说明 - MB2M |
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