Suggested Soldering Temperature Profile

Recom m ended reflow m ethods: IR, vapor phase oven, hot air oven, wave solder.

The device can be exposed to a m axim um tem perature of 265°C for 10 seconds.

Devices can be cleaned using standard industry m ethods and solvents.

If reflow temperatures exceed the recom m ended profile, devices m ay not m eet the

p erfo rm a nce re q uire m e nts.

Note

Package Information

Carrier Dimension(mm)

A0

B0

K0

D0

4.40

4.0

6.90

8.0

1.30

2.0

1.55

0.25

1.75

12

E

F

7.50

P0

P1

P2

T

W

0.1

Tolerance

Package Specifications

Package Reel Size

Q'TY/Reel

Box Size

QTY/Box

Reel DIA.

(mm)

(Kpcs)

(mm)

(Kpcs)

TO-277B

13'

5.0

340

10.0

330

SL540~SL5100

Shanghai Leiditech Electronic Co.,Ltd

Email: sale1@leiditech.com

Tel : +86- 021 50828806

Fax : +86- 021 50477059

Rev 2.0 :

www.leiditech.com

12.01.2019

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