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TL331 数据表(PDF) 2 Page - ON Semiconductor

部件名 TL331
功能描述  Comparator, Single Channel, Open Collector, Low Power, Wide Supply Range
PDF  7 Pages
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制造商  ONSEMI [ON Semiconductor]
网页  http://www.onsemi.com
标志 ONSEMI - ON Semiconductor

TL331 数据表(HTML) 2 Page - ON Semiconductor

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TL331, TL331V
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Table 1. MAXIMUM RATINGS (Over operating free−air temperature, unless otherwise stated)
Parameter
Symbol
Limit
Unit
Supply Voltage (VCC − VEE)
VS
36
V
INPUT AND OUTPUT PINS
Input Voltage (Note 1)
VIN
±36
V
Differential Input Voltage (Note 1)
VID
−0.3 to 36
V
Output Short Circuit Current (Note 2)
ISC
20
mA
TEMPERATURE
Storage Temperature
TSTG
−65 to +150
°C
Junction Temperature
TJ
+150
°C
ESD RATINGS
Human Body Model
HBM
2000
V
Charged Device Model
CDM
2500
V
Machine Model
MM
150
V
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. Positive excursions of the input voltage may exceed the power supply level. The low input voltage state must not be less than 0.3 V below
the negative supply rail.
2. Short circuits from the output to VCC can cause excessive heating and potential destruction. The maximum short circuit current is independent
of the magnitude of VCC.
Table 2. THERMAL INFORMATION (Note 3)
Parameter
Symbol
Single Layer Board
(Note 4)
Multi−Layer Board
(Note 5)
Unit
Junction to Ambient Thermal Resistance
qJA
274
209
°C/W
3. Short−circuits can cause excessive heating and destructive dissipation. These values are typical.
4. Values based on a 1S standard PCB according to JEDEC 51−3 with 1.0 oz copper and a 400 mm2 copper area
5. Values based on a 1S2P standard PCB according to JEDEC 51−7 with 1.0 oz copper and a 25 mm2 copper area
Table 3. OPERATING CONDITIONS
Parameter
Symbol
Limit
Unit
Operating Supply Voltage
VS
2 to 36
V
Specified Operating Range
TA
−40 to +125
°C
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.



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