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TL331 数据表(PDF) 2 Page - ON Semiconductor |
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TL331 数据表(HTML) 2 Page - ON Semiconductor |
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2 / 7 page ![]() TL331, TL331V www.onsemi.com 2 Table 1. MAXIMUM RATINGS (Over operating free−air temperature, unless otherwise stated) Parameter Symbol Limit Unit Supply Voltage (VCC − VEE) VS 36 V INPUT AND OUTPUT PINS Input Voltage (Note 1) VIN ±36 V Differential Input Voltage (Note 1) VID −0.3 to 36 V Output Short Circuit Current (Note 2) ISC 20 mA TEMPERATURE Storage Temperature TSTG −65 to +150 °C Junction Temperature TJ +150 °C ESD RATINGS Human Body Model HBM 2000 V Charged Device Model CDM 2500 V Machine Model MM 150 V Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. Positive excursions of the input voltage may exceed the power supply level. The low input voltage state must not be less than 0.3 V below the negative supply rail. 2. Short circuits from the output to VCC can cause excessive heating and potential destruction. The maximum short circuit current is independent of the magnitude of VCC. Table 2. THERMAL INFORMATION (Note 3) Parameter Symbol Single Layer Board (Note 4) Multi−Layer Board (Note 5) Unit Junction to Ambient Thermal Resistance qJA 274 209 °C/W 3. Short−circuits can cause excessive heating and destructive dissipation. These values are typical. 4. Values based on a 1S standard PCB according to JEDEC 51−3 with 1.0 oz copper and a 400 mm2 copper area 5. Values based on a 1S2P standard PCB according to JEDEC 51−7 with 1.0 oz copper and a 25 mm2 copper area Table 3. OPERATING CONDITIONS Parameter Symbol Limit Unit Operating Supply Voltage VS 2 to 36 V Specified Operating Range TA −40 to +125 °C Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended Operating Ranges limits may affect device reliability. |
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