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ABSOLUTE MAXIMUM RATINGS

(1)

RECOMMENDED OPERATING CONDITIONS

DISSIPATION RATINGS TABLE PER PACKAGE

THS4281

SLOS432 – APRIL 2004

These devices have limited built-in ESD protection. The leads should be shorted together or the device

placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

over operating free-air temperature range (unless otherwise noted)

UNIT

16.5 V

±V

±2 V

±100 mA

Continuous power dissipation

See Dissipation Rating Table

150

°C

125

°C

-65

°C to 150°C

Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds

300

°C

HBM

3500 V

ESD ratings

CDM

1500 V

MM

100 V

(1)

The absolute maximum ratings under any condition is limited by the constraints of the silicon process. Stresses above these ratings may

cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. These are

stress ratings only, and functional operation of the device at these or any other conditions beyond those specified is not implied.

(2)

The maximum junction temperature for continuous operation is limited by package constraints. Operation above this temperature may

result in reduced reliability and/or lifetime of the device. recommended operating conditions.

MIN

MAX

UNIT

Dual supply

±1.35

±8.25

V

Single supply

2.7

16.5

θ

JA

(1)

θ

JC

PACKAGE

(

°C/W)

(

°C/W)

DBV (5)

55

255.4

391 mW

156 mW

D (8)

38.3

97.5

1.02 W

410 mW

DGK (8)

71.5

180.8

553 mW

221 mW

(1)

This data was taken using the JEDEC standard High-K test PCB.

(2)

Power rating is determined with a junction temperature of 125

°C. This is the point where distortion starts to substantially increase.

Thermal management of the final PCB should strive to keep the junction temperature at or below 125

°C for best performance and long

term reliability.

2