TSML100 datasheet(2/2 Pages) LEIDITECH

部件名	TSML100

功能描述	Small size of 0603 Low resistance

PDF	2 Pages

Scroll/Zoom	100%

制造商	LEIDITECH [Shanghai Leiditech Electronic Technology Co., Ltd]

网页	http://www.leiditech.com

标志

2 / 2 page

TSML100

Solder Reflow Recommendations

Solder Pad Layouts

Part number

(mm)

TSML100

0.60

1.10

1.00

* Recommended reflow methods: IR, Vapor phase, hot air

oven.

* Devices can be cleaned using standard industry methods

and solvents.

Notes:

 If reflow temperatures exceed the recommended profile,

devices may not meet the performance requirements.

 Devices are not designed to be wave soldered to the

bottom side of the board.

Package Information

Tape & Reel: 5000pcs per reel.

Effectivity: Reference documents shall be the issue in effect

on the date of invitation for bid.

Caution: Operation beyond the rated voltage or current may

result in rupture electrical arcing or flame.

Shanghai Leiditech Electronic Co.,Ltd

Email: sale1@leiditech.com

Tel : +86- 021 50828806

Fax : +86- 021 50477059

Rev :

www.leiditech.com

01.06.2015

2/2

TSML100 数据表(PDF) 2 Page - Shanghai Leiditech Electronic Technology Co., Ltd