TSML200 datasheet(2/2 Pages) LEIDITECH

部件名	TSML200

功能描述	Lead-free and compliant with the European Union RoHS Directive

PDF	2 Pages

Scroll/Zoom	100%

制造商	LEIDITECH [Shanghai Leiditech Electronic Technology Co., Ltd]

网页	http://www.leiditech.com

标志

2 / 2 page

TSML200

Solder Reflow Recommendations

Solder Pad Layouts

Part number

(mm)

TSML200

0.60

1.10

1.00

* Recommended reflow methods: IR, Vapor phase, hot air oven.

* Devices can be cleaned using standard industry methods and

solvents.

Notes:

 If reflow temperatures exceed the recommended profile, devices

may not meet the performance requirements.

 Devices are not designed to be wave soldered to the bottom side

of the board.

Package Information

Tape & Reel:5000pcs per reel.

Effectivity: Reference documents shall be the issue in effect on the

date of invitation for bid.

Caution: Operation beyond the rated voltage or current may result in

rupture electrical arcing or flame.

Specifications are subject to change without notice

Shanghai Leiditech Electronic Co.,Ltd

Email: sale1@leiditech.com

Tel : +86- 021 50828806

Fax : +86- 021 50477059

Rev :

www.leiditech.com

01.06.2015

2/2

TSML200 数据表(PDF) 2 Page - Shanghai Leiditech Electronic Technology Co., Ltd