LTM8060

2

Rev. 0

For more information www.analog.com

PIN CONFIGURATION

ABSOLUTE MAXIMUM RATINGS

FB

n, TRSSn, SHAREn, RTn .......................................4V

(Note 1)

BGA PACKAGE

165-LEAD (11.9mm × 16mm × 3.32mm)

θ VALUES DETERMINED PER JEDEC 51 CONDITIONS;

BANK3

BANK1

BANK7

BANK4

BANK6

BANK8

GND

SHARE3

SHARE4

FB1

RT12 TRSS2 TRSS1

FB2

SHARE2

SHARE1

AUX2 BIAS12 AUX1

7

6

8

9

10

11

5

4

3

2

1

A

B

C

D

E

F

G

H

J

K

L

M

N

P

R

RUN2 RUN1

SYNC12

PG2

DNC

PG1

CLKOUT12

BIAS34 AUX4

AUX3

TRSS4 RT34

FB4

FB3

TRSS3

PG4 CLKOUT34

DNC

PG3

RUN4 SYNC34

RUN3

BANK2

TOP VIEW

ORDER INFORMATION

PART NUMBER

BALL FINISH

PART MARKING*

PACKAGE

TYPE

MSL

RATING

TEMPERATURE RANGE

(SEE NOTE 2)

DEVICE

FINISH CODE

LTM8060IY#PBF

SAC305 (RoHS)

LTM8060Y

e1

BGA

3

–40°C to 125°C

LTM8060IY

SnPb (63/37)

e0

–40°C to 125°C

• Device temperature grade is indicated by a label on the shipping container.

• Pad code is per IPC/JEDEC J-STD-609.

• BGA Package and Tray Drawings

• This product is not recommended for second side reflow.

This product is moisture sensitive. For more information, go to

Recommended BGA PCB Assembly and Manufacturing Procedures.

SYNC

n .......................................................................6V

Maximum Internal Temperature (Note 2) .............. 125°C

Storage Temperature ............................. –55°C to 125°C

Peak Solder Reflow Package Body Temperature .. 245°C