ADRF5160

Data Sheet

Rev. 0 | Page 12 of 12

OUTLINE DIMENSIONS

1

0.50

BSC

BOTTOM VIEW

TOP VIEW

PIN 1

INDICATOR

32

9

16

17

24

25

8

EXPOSED

PAD

SEATING

PLANE

0.05 MAX

0.02 NOM

0.20 REF

COPLANARITY

0.08

0.30

0.25

0.18

5.10

5.00 SQ

4.90

0.90

0.85

0.80

0.45

0.40

0.35

0.20 MIN

3.80

3.70 SQ

3.60

COMPLIANT TO JEDEC STANDARDS MO-220-VHHD-4.

3.50 REF

PIN 1

INDIC ATOR AREA OPTIONS

(SEE DETAIL A)

DETAIL A

(JEDEC 95)

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

Figure 18. 32-Lead Lead Frame Chip Scale Package [LFCSP]

5 mm × 5 mm Body and 0.85 mm Package Height

(HCP-32-1)

Dimensions shown in millimeters

ORDERING GUIDE

Temperature Range

Package Description

Package Option

ADRF5160BCPZ

−40°C to +105°C

MSL3

32-lead Lead Frame Chip Scale Package [LFCSP]

HCP-32-1

ADRF5160BCPZ-R7

−40°C to +105°C

MSL3

32-lead Lead Frame Chip Scale Package [LFCSP]

HCP-32-1

ADRF5160-EVALZ

Evaluation Board

1

Z = RoHS Compliant Part.

2

See the Absolute Maximum Ratings section for additional information.

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D16518-0-5/18(0)