Data Sheet

ADMV1010

Rev. B | Page 5 of 21

PIN CONFIGURATION AND FUNCTION DESCRIPTIONS

24 NIC

ADMV1010

TOP VIEW

(Not to Scale)

23 NIC

22 IF2

21 NIC

20 NIC

19 IF1

18 NIC

17 NIC

NOTES

1. NIC = NOT INTERNALLY CONNECTED. THESE

PINS ARE NOT INTERNALLY CONNECTED. IT IS

RECOMMENDED TO GROUND THESE PINS ON THE PCB.

2. EXPOSED PAD. EXPOSED PAD MUST BE

CONNECTED TO GND. GOOD RF AND THERMAL

GROUNDING IS RECOMMENDED.

1

2

3

4

5

6

7

8

NIC

GND

RFIN

GND

NIC

NIC

NIC

NIC

Figure 2. Pin Configuration

Table 4. Pin Function Descriptions

Pin No.

Mnemonic

Description

1, 5 to 9, 12, 13, 15 to 18,

20, 21, 23 to 27, 29 to 32

NIC

Not Internally Connected. These pins are not internally connected. It is recommended to ground

these pins on the PCB.

2, 4, 11

GND

Ground.

3

RFIN

RF Input. This pin is ac-coupled internally and matched to 50 Ω, single-ended.

10

LO_IN

LO Input. This pin is ac-coupled internally and matched to 50 Ω single-ended.

14

VDLO

Power Supply Voltage for the LO Amplifier. Refer to the Applications Information section for the

required external components and biasing.

19

IF1

Quadrature IF Output 1. Matched to 50 Ω and ac coupled. No external dc block required.

22

IF2

Quadrature IF Output 2. Matched to 50 Ω and ac coupled. No external dc block required.

28

VDRF

Power Supply Voltage for the RF Amplifier. Refer to the Applications Information section for the

required external components and biasing.

EPAD

Exposed Pad. The exposed pad must be connected to GND. Good RF and thermal grounding is

recommended.