Data Sheet

HMC129ALC4

Rev. 0 | Page 5 of 16

PIN CONFIGURATION AND FUNCTION DESCRIPTIONS

Figure 2. Pin Configuration

Table 4. Pin Function Descriptions

Pin No.

Mnemonic

Description

1, 5, 6, 7, 11 to 14,

18 to 24

NIC

Not Internally Connected. These pins can be connected to RF/dc ground. Performance is not affected.

2, 4, 8, 10, 15, 17

GND

Ground. These pins and package bottom must be connect to RF/dc ground.

3

RF

Radio Frequency Port. This pin is ac-coupled and matched to 50 Ω.

9

IF

Intermediate Frequency Port. This pin is dc-coupled. For applications not requiring operation to dc, dc

block this port externally using a series capacitor of a value chosen to pass the necessary IF frequency

range. For operation to dc, this pin must not source/sink more than 6 mA of current or die malfunction

and possible die failure may result.

16

LO

Local Oscillator Port. This pin is dc-coupled and matched to 50 Ω.

EPAD

Exposed Pad. The exposed pad must be connected to RF/dc ground.

INTERFACE SCHEMATICS

Figure 3. GND Interface Schematic

Figure 4. LO Interface Schematic

Figure 5. IF Interface Schematic

Figure 6. RF Interface Schematic

13

1

3

4

2

NIC

GND

RF

GND

5

6

NIC

NIC

NIC

PACKAGE

BASE

GND

14 NIC

15 GND

16 LO

17 GND

18 NIC

HMC129ALC4

TOP VIEW

(Not to Scale)

NOTES

1. NIC = NOT INTERNALLY CONNECTED. THESE

PINS CAN BE CONNECTED TO RF/DC

GROUND. PERFORMANCE IS NOT AFFECTED.

2. EXPOSED PAD. THE EXPOSED PAD MUST BE

CONNECTED TO RF/DC GROUND.

GND

LO

IF

RF