SDIP30 datasheet(1/2 Pages) STMICROELECTRONICS

部件名	SDIP30

功能描述	SDIP30 Thermal Data

PDF	2 Pages

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制造商	STMICROELECTRONICS [STMicroelectronics]

网页	http://www.st.com

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Thermal Data

SDIP 30

item #

material

thickness

thermal

conductivity

leadframe

copper

0.25 mm

2.61 W/cm°C

die attach

epoxy glue

( silver filler )

10-40 µm

0.01 W/cm°C

molding

compound

epoxy resin

3.8 mm

0.0063W/cm°C

PACKAGE MATERIAL LIST

September 1999

1/2

Charts enclosed :

1) Rth(j-a) vs power dissipation

2) Zth(j-a) vs time

30 leads



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