HMC553ALC3BTR-R5 datasheet(24/25 Pages) AD

24 / 25 page

HMC553ALC3B

Data Sheet

Rev. B | Page 24 of 25

APPLICATIONS INFORMATION

TYPICAL APPLICATION CIRCUIT

Figure 82 shows the typical application circuit for the

HMC553ALC3B. The HMC553ALC3B is a passive device and

does not require any external components. The LO and RF pins

are internally ac-coupled. The IF pin is internally dc-coupled.

When IF operation to dc is not required, use of an external

series capacitor is recommended, of a value chosen to pass the

necessary IF frequency range. When IF operation to dc is

required, do not exceed the IF source and sink current rating

specified in the Absolute Maximum Ratings section.

GND

HMC553ALC3B

Figure 82. Typical Application Circuit

EVALUATION PCB INFORMATION

Use RF circuit design techniques for the circuit board used in

the application. Ensure that signal lines have 50 Ω impedance,

and connect the package ground leads and the exposed pad

directly to the ground plane (see Figure 83). Use a sufficient

number of via holes to connect the top and bottom ground

planes. The evaluation circuit board shown in Figure 83 is

available from Analog Devices, Inc., upon request.

Table 7. List of Materials for Evaluation PCB

EV1HMC553ALC3B

Item

Description

J1, J2

SRI 2.92 mm connector

Johnson Surface-Mount Type A (SMA) connector

HMC553ALC3B

PCB1

117611-7 evaluation board

1 117611-7 is the raw bare PCB identifier. Reference EV1HMC553ALC3B when

ordering the complete evaluation PCB.

117611–7

553A

Figure 83. Evaluation PCB Top Layer

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