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REF50 数据表(PDF) 6 Page - Texas Instruments

部件名 REF50
功能描述  REF34xx Low-Drift, Low-Power, Small-Footprint Series Voltage Reference
PDF  31 Pages
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制造商  TI [Texas Instruments]
网页  http://www.ti.com
标志 TI - Texas Instruments

REF50 数据表(HTML) 6 Page - Texas Instruments

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7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)
MIN
MAX
UNIT
Input voltage
IN
–0.3
13
V
EN
–0.3
IN + 0.3
V
Output voltage
VOUT
–0.3
5.5
V
Output short circuit current
ISC
20
mA
Operating temperature range
TA
–55
150
°C
Storage temperature range
Tstg
–65
170
°C
(1)
Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may
degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond
those specified is not implied. These are stress ratings only and functional operation of the device at these or any other conditions
beyond those specified in the Electrical Characteristics Table is not implied.
7.2 ESD Ratings
VALUE
UNIT
V(ESD)
Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/
JEDEC JS-001(1)
±2500
V
Charged-device model (CDM), per JEDEC
specification JESD22-C101(2)
±1500
(1)
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2)
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
7.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
NOM
MAX
UNIT
IN
Input Voltage
VOUT +
VDO (1)
12
V
EN
Enable Voltage
0
IN
V
IL
Output Current
–10
10
mA
TA
Operating Temperature
–40
25
125
°C
(1)
VDO = Dropout voltage
7.4 Thermal Information
THERMAL METRIC(1)
REF34T
REF34
UNIT
DBV
DBV
6 PINS
6 PINS
RθJA
Junction-to-ambient thermal resistance
122.6
122.6
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
80.2
80.2
°C/W
RθJB
Junction-to-board thermal resistance
42
42
°C/W
ΨJT
Junction-to-top characterization parameter
23.2
23.2
°C/W
ΨJB
Junction-to-board characterization parameter
41.9
41.9
°C/W
RθJC(bot)
Junction-to-case (bottom) thermal resistance
N/A
N/A
°C/W
REF3425, REF3430, REF3433, REF3440, REF3450
SBAS804F – SEPTEMBER 2017 – REVISED JUNE 2021
www.ti.com
6
Submit Document Feedback
Copyright © 2021 Texas Instruments Incorporated
Product Folder Links: REF3425 REF3430 REF3433 REF3440 REF3450



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