3

8TWS..S

Preliminary Data Sheet I2132 rev. C 10/99

Thermal-Mechanical Specifications

T

J

Max.Junction Temperature Range - 40 to 125

°C

T

stg

Max. Storage Temperature Range

- 40 to 125

Soldering Temperature

240

°C

for 10 seconds (1.6mm from case)

R

thJC

Max. Thermal Resistance Junction

2.0

°C/W

DC operation

to Case

R

thJA

Max. Thermal Resistance Junction

65

°C/W

to Ambient (PCB Mount)**

wt

ApproximateWeight

1(0.03)

g(oz.)

T

Case Style

TO-252AA(D-PAK)

Parameters

8TWS..S

Units

Conditions

Triggering

P

GM

Max. peak Gate Power

8.0

W

Max. average Gate Power

2.0

+ I

GM

Max. paek positive Gate Current

1.5

A

Max. paek negative Gate Voltage

10

V

Max. required DC Gate Current

20

mA

to trigger

15

10

Anode supply = 6V, resistive load, T

Max. required DC Gate Voltage

1.2

V

to trigger

1

Anode supply = 6V, resistive load, T

0.75

Anode supply = 6V, resistive load, T

Max. DC Gate Voltage not to trigger

0.20

Max. DC Gate Current not to trigger

0.10

mA

Parameters

8TWS..S

Units

Conditions

Switching

Parameters

8TWS..S

Units

Conditions

t

gt

Typical turn-on time

0.8

µs

T

t

rr

Typical reverse recovery time

3

T

t

q

Typical turn-off time

100

Forrecommendedfootprintandsolderingtechniquesrefertoapplicationnote#AN-994