Figure 25 : Maximum Dissipable Power and Junc-

tion to Ambient Thermal Resistance

versus Side "

α"

Figure 26 : Maximum Allowable Power Dissipa-

tion versus Ambient Temperature

Figure 24 : External Heatsink Mounting Example

Figure 23 : Example of P.C. Board Copper Area

Which is Used as Heatsink

MOUNTING INSTRUCTION

dering the GND pins to a suitable copper area of the

printed circuit board (Fig. 23) or to an external

heatsink (Fig. 24).

The diagram of figure 25 shows the maximum dis-

the side "

α" of two equal square copper areas hav-

ing a thickness of 35

µ (1.4 mils). During soldering

the pins temperature must not exceed 260

°C and

the soldering time must not be longer than 12 sec-

onds.

The external heatsink or printed circuit copper area

must be connected to electrical ground.

L6221AS - L6221AD - L6221N

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