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HMC8191LC4TR-R5 数据表(PDF) 44 Page - Analog Devices |
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HMC8191LC4TR-R5 数据表(HTML) 44 Page - Analog Devices |
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44 / 44 page ![]() HMC8191 Data Sheet Rev. C | Page 44 of 44 OUTLINE DIMENSIONS 12 0.50 BSC 2.50 REF BOTTOM VIEW TOP VIEW 1 24 7 13 18 19 6 0.36 0.30 0.24 EXPOSED PAD PIN 1 INDICATOR 4.05 3.90 SQ 3.75 3.10 BSC FOR PROPER CONNECTION OF THE EXPOSED PAD, REFER TO THE PIN CONFIGURATION AND FUNCTION DESCRIPTIONS SECTION OF THIS DATA SHEET. 2.60 2.50 SQ 2.40 PIN 1 0.32 BSC 0.08 BSC SIDE VIEW 1.00 0.90 0.80 SEATING PLANE Figure 157. 24-Terminal Ceramic Leadless Chip Carrier [LCC] (E-24-1) Dimensions shown in millimeters ORDERING GUIDE Model1 Temperature Range Package Body Material Lead Finish Package Description MSL Rating2 Package Option HMC8191LC4 −40°C to +85°C Alumina Ceramic Gold over Nickel 24-Terminal Ceramic LCC MSL3 E-24-1 HMC8191LC4TR −40°C to +85°C Alumina Ceramic Gold over Nickel 24-Terminal Ceramic LCC MSL3 E-24-1 HMC8191LC4TR-R5 −40°C to +85°C Alumina Ceramic Gold over Nickel 24-Terminal Ceramic LCC MSL3 E-24-1 EV1HMC8191LC4 Evaluation PCB Assembly 1 The HMC8191LC4, HMC8191LC4TR, and HMC8191LC4TR-R5 are RoHS compliant parts. 2 See the Absolute Maximum Ratings section. ©2017–2019 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D13645-0-8/19(C) |
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