MODEL: R3-GSLMP1

R3-GSLMP1 SPECIFICATIONS

ES-8275 Rev.2 Page 2/10

https://www.m-system.co.jp/

Baud rate: 10/100 Mbps (Auto Negotiation function)

Protocol: SLMP

Data: Binary

Max. number of socket connections: 1

Max. number of communication entries: 16

Max. number of I/O signals: 128 points (total of analog and

discrete signals)

Transmission media: 10BASE-T (STP, Category 5), 100BASE-

TX (STP, Category 5e)

Max. number of virtual I/O modules: 16

Ethernet indicator LED: LINK, DPLX, LINK10, LINK100, COL

Max. length of fieldbus segment: 100 meters

IP address: 192.168.0.1 (factory setting);

Selectable with PC Configurator Software (model: R3CON)

Connectable devices: MELSEC iQ-R series, MELSEC iQ-F

series, MELSEC Q series

INSTALLATION

Operating temperature: -10 to +55°C (14 to 131°F)

Operating humidity: 30 to 90 %RH (non-condensing)

Atmosphere: No corrosive gas or heavy dust

Mounting: Installation Base (model: R3-BSx)

Weight: 200 g (0.44 lb)

PERFORMANCE

Data Allocation (No. of Occupied Data Areas)

Virtual AI module: 16

Virtual AO module: 16

Virtual DI module: 1

Virtual DO module: 1

Current consumption: 100 mA

Insulation resistance: ≥ 100 MΩ with 500 V DC

Dielectric strength: 1500 V AC @ 1 minute

(Ethernet to internal bus or internal power to RUN contact

output)

2000 V AC @ 1 minute (power input to FG; isolated on the

power supply module)

STANDARDS & APPROVALS

EU conformity:

EMC Directive

EMI EN 61000-6-4

EMS EN 61000-6-2

RoHS Directive