S2DFSH

– S2MFSH

Taiwan Semiconductor

2

Version: B2103

THERMAL PERFORMANCE

PARAMETER

SYMBOL

TYP

UNIT

Junction-to-lead thermal resistance

14

°C/W

Junction-to-ambient thermal resistance

74

°C/W

Junction-to-case thermal resistance

20

°C/W

Thermal Performance Note: Units mounted on PCB (5mm x 5mm Cu pad test board)

PARAMETER

CONDITIONS

SYMBOL

TYP

MAX UNIT

Forward voltage

(1)

0.91

-

V

0.98

1.10

V

0.79

-

V

0.88

0.98

V

(2)

-

1

µA

-

33

µA

Junction capacitance

12

-

pF

Notes:

(1) Pulse test with PW = 0.3ms

(2) Pulse test with PW = 30ms

ORDERING INFORMATION

PACKAGE

PACKING

S2xFSH

SOD-128

14,000 / Tape & Reel

Notes:

(1)

“x” defines voltage from 200V(S2DFSH) to 1000V(S2MFSH)