ES2BAL

– ES2JAL

Taiwan Semiconductor

2

Version: D2103

THERMAL PERFORMANCE

PARAMETER

SYMBOL

TYP

UNIT

Junction-to-lead thermal resistance

24

°C/W

Junction-to-ambient thermal resistance

72

°C/W

Junction-to-case thermal resistance

14

°C/W

Thermal Performance Note: Units mounted on PCB (5mm x 5mm Cu pad test board)

PARAMETER

CONDITIONS

SYMBOL

TYP

MAX

UNIT

Forward voltage

(1)

ES2BAL

ES2DAL

0.82

-

V

0.88

0.95

V

0.66

-

V

0.74

0.84

V

ES2GAL

0.89

-

V

0.97

1.30

V

0.72

-

V

0.81

0.91

V

ES2JAL

1.11

-

V

1.24

1.70

V

0.86

-

V

1.01

1.14

V

(2)

-

1

µA

-

25

µA

Reverse recovery time

-

35

ns

Junction capacitance

ES2BAL

ES2DAL

28

-

pF

ES2GAL

27

-

pF

ES2JAL

21

-

pF

Notes:

1.

Pulse test with PW = 0.3ms

2.

Pulse test with PW = 30ms

ORDERING INFORMATION

PACKAGE

PACKING

ES2xAL

Thin SMA

14,000 / Tape & Reel

Notes:

1.

"x" defines voltage from 100V(ES2BAL) to 600V(ES2JAL)