Data Sheet

HMC1048ALC3B

Rev. B | Page 13 of 15

APPLICATIONS INFORMATION

EVALUATION BOARD

Figure 30 and Figure 31 show the top and cross sectional views of

the EV1HMC1048ALC3B evaluation board, which uses 4-layer

construction with a copper thickness of 0.5 oz (0.7 mil) and

dielectric materials between each copper layer.

All RF traces are routed on Layer 1, and all other remaining layers

are grounded planes that provide a solid ground for RF trans-

mission lines. The top dielectric material is Rogers 4350, offering

low loss performance. The prepreg material in the middle is used to

attach the core layers together, the RoHS compliant Isola 370HR

and the Rogers 4350 layers, with copper traces above and below the

prereg material. Both the prepreg and the Isola 370HR core layer

are used to achieve the required board finish thickness.

The RF transmission lines were designed using a coplanar

waveguide (CPWG) model with a width of 18 mil and ground

spacing of 13 mil for a characteristic impedance of 50 Ω. For

optimal RF and thermal grounding, as many plated through vias as

possible are arranged around the transmission lines and under the

exposed pad of the package.

Figure 30. EV1HMC1048ALC3B Evaluation Board Layout Top View

0.5oz Cu (0.7mil)

ISOL 370HR AS REQUIRED

10 mil ARLON 25 FR OR ROGERS 4350

PREPREG AS REQUIRED

0.5oz Cu (0.7mil)

0.5oz Cu (0.7mil)

0.5oz Cu (0.7mil)

0.5oz Cu (0.7mil)

0.5oz Cu (0.7mil)

W = 18mil

G = 13mil

Figure 31. EV1HMC1048ALC3B Evaluation Board Cross Sectional View