HSMM-A101-R00J1 datasheet(9/13 Pages) HP

9 / 13 page

Figure 8a. Recommended SnPb reflow soldering profile.

240°C MAX.

20 SEC. MAX.

3°C/SEC.

MAX.

120 SEC. MAX.

TIME

183°C

100-150°C

–6°C/SEC.

MAX.

60-150 SEC.

3°C/SEC. MAX.

Figure 7. Radiation Pattern.

1.0

ANGULAR DISPLACEMENT – DEGREES

0.8

0.6

0.2

0.4

-70

-50

-30

20 30

-90

-20

-80

-60

-40

-10

Figure 9. Recommended wave soldering profile.

-0.3

-100

TEMPERATURE – °C

0.5

0.4

0.2

0.1

-0.2

150

-50

100

-0.1

0.3

GaP/AlGaAs/

AlInGaP

InGaN/GaN

Figure 6. Forward voltage shift vs. temperature.

Figure 8b. Recommended Pb-free reflow soldering profile.

217 °C

MAX. 120 SEC.

6 °C/SEC. MAX.

3 °C/SEC. MAX.

125 °C ± 25 °C

255 °C

60 to 150 SEC.

10 to 20 SEC.

TIME

* THE TIME FROM 25 °C TO PEAK TEMPERATURE = 6 MINUTES MAX.

+5 °C

-0 °C

LAMINAR WAVE

BOTTOM SIDE

OF PC BOARD

HOT AIR KNIFE

TURBULENT WAVE

FLUXING

PREHEAT

010

100

150

200

250

TIME – SECONDS

100

TOP SIDE OF

PC BOARD

CONVEYOR SPEED = 1.83 M/MIN (6 FT/MIN)

PREHEAT SETTING = 150

°C (100°C PCB)

SOLDER WAVE TEMPERATURE = 245

°C

AIR KNIFE AIR TEMPERATURE = 390

°C

AIR KNIFE DISTANCE = 1.91 mm (0.25 IN.)

AIR KNIFE ANGLE = 40

SOLDER: SN63; FLUX: RMA

NOTE: ALLOW FOR BOARDS TO BE SUFFICIENTLY COOLED

BEFORE EXERTING MECHANICAL FORCE.

Figure 10. Recommended soldering pad pattern.

2.60

4.50

1.50

;;

;;;

;;

SOLDER RESIST

HSMM-A101-R00J1 数据表(PDF) 9 Page - Agilent(Hewlett-Packard)

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