5.2

Thermal Specifications

The following tables list the thermal specifications the PD69208T4, PD69204T4, and PD69208M.

Table 5-2. Thermal Specifications

Thermal Resistance

Typ

Units

Notes

19.0

°C/W

Junction-to-ambient thermal resistance.

0.05

°C/W

Junction-to-top thermal characterization parameter. A

thermal metric derived from the difference in junction

temperature (TJ) and package top temperature (TT)

divided by total heating power (PH).

4.9

°C/W

Junction-to-case thermal resistance with heat flow through

package top.

15.2

°C/W

Junction-to-board thermal resistance.

Note: All parameters are as per JEDEC JESD-51.

PD69208T4/PD69204T4/PD69208M

Package Information

Datasheet

DS00003428C-page 22