PLL701-10

Low EMI Spread Spectrum Multiplier IC (in Die or Package)

47745 Fremont Blvd., Fremont, California 94538 Tel (510) 492-0990 Fax (510) 492-0991 www.phaselink.com Rev 09/20/04 Page 3

PIN/PAD DESCRIPTIONS

Name

Pin #

Pad #

Type

Description

XIN/FIN

1

22

I

Crystal input to be connected to fundamental parallel mode crystal.

XOUT/SD0

2

23

B

At power-up, this pin is acts as input pin to select the modulation

rate and is latched in. After the input sampling, it is used as crystal

output connector. 120k

Ω internal pull up resistor.

M2

3

28

I

Digital control input to select output frequency. 30k

Ω internal pull-

up.

M1

4

29

I

Digital control input to select output frequency. 30k

Ω internal pull-

up.

M0

5

30

I

Digital control input to select output frequency. 30k

Ω internal pull-

up.

SC0

6

34

I

Digital control input to select spread spectrum modulation.

30k

Ω internal pull-up.

SC1

7

35

I

Digital control input to select spread spectrum modulation.

30k

Ω internal pull-up.

SC2

8

1

I

Digital control input to select spread spectrum modulation.

30k

Ω internal pull-up.

SC3

12

12

I

Digital control input to select spread spectrum modulation.

30k

Ω internal pull-up.

FOUT

10

8

O

Modulated Clock Frequency Output. The frequency before

modulation is synthesized by multiplying the input frequency by 1X

to 8X, depending on SD(0:1) and SC(0:3).

OE

11

10

I

Output Enable. When low, Tri-states all outputs.

30k

Ω internal pull-up.

VDD

13

13,14,15

P

3.3V Power Supply.

REF/SD1

14

16

B

At power-up, this pin acts as input pin to select the modulation rate

and is latched in. After the input sampling, this pin provides a

buffered Reference Clock Output of the same frequency as the

crystal or clock input. 30k

Ω internal pull-up.

AVDD

15

17,18,19

P

3.3V Analog power supply.

GNDOSC

N/A

25

P

Ground for Oscillator circuitry.

GNDBUF

N/A

7

P

Ground for output buffer circuitry.

GND

9 and 16

4,5,6,20,21

P

Ground.

Notes: B – bi-directional pin; I – input pin; P – power supply/ground pin.

DIE SPECIFICATIONS

Name

Value

Size

104 x 69 mil

Reverse side

GND

Pad dimensions

80 micron x 80 micron

Thickness

10 mil