SC14WAMDECT datasheet(31/36 Pages) DIALOG

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Datasheet

Revision 3.0

23-Jul-2015

CFR0011-120-00-FM Rev 5

31 of 36

SC14WAMDECT SF

Wireless Audio Module

FINAL

10.0 Package information

10.1 SOLDERING PROFILE

The SC14WAMDECT SF should be soldered using a

lead-free reflow soldering profile as shown below.

Adjustments to the profile may be necessary depend-

ing on process requirements.

Recommended solder paste for lead-free soldering:

Sn 96.5 % - Ag 3.0 % - Cu 0.5 %.

10.2 MOISTURE SENSITIVITY LEVEL (MSL)

The MSL is an indicator for the maximum allowable

time period (floor life time) in which a moisture sensi-

tive plastic device, once removed from the dry bag, can

be exposed to an environment with a maximum tem-

perature of 30 °C and a maximum relative humidity of

60 % RH. before the solder reflow process.

The SC14WAMDECT SF is qualified to MSL 3.

Figure 17: Reflow profile (lead-free)

Time

217 °C

25 °C

Slope: 1~2 °C/s max.

(217 °C to peak)

Ramp down rate:

max. 3 °C/s

Peak temperature:

250 °C +5/-0 °C

245 °C

Temperature

>30 s

60 ~ 150 s

60 ~ 120 s

Preheat:

150 ~ 200 °C

MSL Level

Floor Life Time

MSL 4

72 hours

MSL 3

168 hours

MSL 2A

4 weeks

MSL 2

1 year

MSL 1

Unlimited at 30 °C/85 % RH

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