ADMV8420

Data Sheet

Rev. B | Page 14 of 14

OUTLINE DIMENSIONS

0.80

0.75

0.70

0.50

BSC

0.50

0.40

0.30

COMPLIANT

TO JEDEC STANDARDS MO-220-WGGD-8

BOTTOM VIEW

TOP VIEW

SIDE VIEW

4.10

4.00 SQ

3.90

0.05 MAX

0.02 NOM

0.20 REF

COPLANARITY

0.08

1

24

7

12

13

18

19

6

0.30

0.25

0.18

0.20 MIN

2.70

2.60 SQ

2.50

EXPOSED

PAD

P IN 1

IN D IC AT O R AR E A OP T IO N S

(SEE DETAIL A)

DETAIL A

(JEDEC 95)

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

PIN 1

INDICATOR

AREA

SEATING

PLANE

Figure 30. 24-Lead Lead Frame Chip Scale Package [LFCSP]

4 mm × 4 mm Body and 0.75 mm Package Height

(CP-24-15)

Dimensions shown in millimeters

ORDERING GUIDE

Temperature Range

Package Description

Package Option

ADMV8420ACPZ

−40°C to +85°C

24-Lead LFCSP

CP-24-15

ADMV8420ACPZ-R5

−40°C to +85°C

24-Lead LFCSP, 7” Tape and Reel

CP-24-15

ADMV8420-EVALZ

Evaluation Board

1

All models are RoHS-compliant parts.

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registered trademarks are the property of their respective owners.

D17199-10/20(B)