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USB5926C/KD 数据表(PDF) 60 Page - Microchip Technology |
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USB5926C/KD 数据表(HTML) 60 Page - Microchip Technology |
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60 / 66 page  USB5926 DS00002234E-page 60 2016-2021 Microchip Technology Inc. FIGURE 11-3: 100-VQFN PACKAGE (LAND PATTERN) RECOMMENDED LAND PATTERN Dimension Limits Units C2 Optional Center Pad Width Contact Pad Spacing Optional Center Pad Length Contact Pitch Y2 X2 8.10 8.10 MILLIMETERS 0.40 BSC MIN E MAX 11.70 Contact Pad Length (X100) Contact Pad Width (X100) Y1 X1 1.05 0.20 Microchip Technology Drawing C04-2407A NOM SILK SCREEN 1 2 100 C1 C2 E X1 Y1 G1 Y2 X2 C1 Contact Pad Spacing 11.70 Contact Pad to Center Pad (X100) G1 0.20 Thermal Via Diameter V Thermal Via Pitch EV 0.33 1.20 ØV EV EV BSC: Basic Dimension. Theoretically exact value shown without tolerances. Notes: Dimensioning and tolerancing per ASME Y14.5M For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during reflow process 1. 2. |
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